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工業技術研究院

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整合中介層之微線寬異質載板技術

技術簡介

 整合中介層之微線寬異質載板技術
整合中介層之微線寬異質載板技術

因應電子產品功能整合、行動通訊裝置輕量化與薄型化持續不斷的需求,工研院開發整合中介層之微線寬異質載板技術,將薄化之細線寬距中介層,藉無凸塊互連整合於現行IC載板,形成創新IC異質整合載板架構EIC(embedded-interposer-carrier substrate),達成下世代高階2.5D或3DIC模組薄化與可靠性提升。EIC已申請多項美國專利,在組裝技術方面,本技術採用非導電性絕緣膜(non-conductive film) 接合,製程峰溫可降至250℃以下,整體封裝架構的優勢在減少2.5D封裝厚度50%以上,並達成線寬/線距3μm/3μm目標,目前已和廠商合作開發試量產技術。



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