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工業技術研究院

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軟性多功能上板技術

技術簡介

 觸控AMOLED之多功能整合上板技術。
觸控AMOLED之多功能整合上板技術。

工研院所發展的FlexUP™為基礎,開發具防刮、耐磨與觸控功能之多功能性上板技術,藉由薄型化Plastic Window保護結構,整合On Cell觸控薄膜,提升觸控薄膜之防刮及耐磨性,並且藉由觸控圖騰(Touch Sensor)設計,可同時減少AMOLED與手指對於觸控感測訊號的干擾,大幅降低OLED's Adhesive以及Plastic Window之厚度,實現薄型化On Cell觸控薄膜技術,以滿足可摺疊AMOLED之產品設計需求。

軟性多功能上板結構設計。
軟性多功能上板結構設計。



延伸閱讀
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