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工業技術研究院

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超快雷射TGV鑽孔技術

技術簡介

 TGV鑽孔光路模組。
TGV鑽孔光路模組。

TGV雷射玻璃鑽孔製程透過雷射改質搭配濕式製程達成高產速鑽孔需求,以工研院最新研發之高均質TGV鑽孔模組,可在50 μm至700 μm玻璃厚度下達成高真圓度TGV製程。

特色與創新

現行玻璃穿孔(TGV))術鑽孔速度緩慢,常造成邊緣品質不佳影響訊號傳輸,工研院開發超快雷射的誘發玻璃成孔技術,搭配同步觸發模組,可提升量產速度至每秒5000孔,鑽孔品質真圓度大於95%、側壁粗糙度低於200nm及最高可達10:1深寬比之細微通孔。

應用與效益

可應用於更輕薄短小的3C高頻通訊裝置、4K攝影等高容量訊號傳輸及次世代Micro LED顯示器。

高真圓度之鑽孔品質
高真圓度之鑽孔品質。
超快雷射之誘發玻璃成孔技術
超快雷射之誘發玻璃成孔技術。


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