『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

雷射倍頻硬脆材料切割技術

技術簡介

為求3C產品的功能精進,常會使用表面有特殊鍍層的硬脆材料基板,如short pass 濾光片,無法使用一般IR雷射進行切割,因此整合倍頻與線型光束技術,縮短雷射切割波長,提升材料對雷射的吸收率與切割精度,解決傳統IR雷射無法穿透材料進行加工的問題。

特色與創新

  • 倍頻光路模組技術。
  • 線型光束模組技術。
  • 雷射切割技術。

技術規格

  • 適用波長:500 nm~560 nm。
  • 可切割材料厚度 ≦ 2 mm。
  • Chipping ≦ 5 μm。
  • Roughness ≦ 1 μm Ra。

應用與效益

半導體、光電、3C產業:

  • 濾光片切割。
  • 藍寶石切割。
  • 玻璃切割。
雷射倍頻硬脆材料切割技術。
雷射倍頻硬脆材料切割技術 。



延伸閱讀
[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]