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工業技術研究院

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透明基板雷射垂直光型切割技術

技術簡介

工研院透過幾何光學干涉方法產生垂直光型雷射切割技術,在材料內部形成長線型光束,以長線光型雷射切割技術取代現有單點加工技術,並開發可變長度線型光路模組,在材料內部形成最佳垂直線型光束,解決傳統單點加工材料去除過程中,加工區周圍的熱影響區極大,造成加工邊緣因熔融產生突緣及毛邊。

特色與創新

  • 聚焦光斑(spot size):≦1 μm。
  • 垂直線型可調景深光路模組(variable length of line beam):0.2 -1.5 mm。
  • 切割速度(cutting speed):≧ 300mm/s。
  • Chipping : ≦10 μm。

應用與效益

半導體,光電產業。
透明基板雷射垂直光型切割技術應用。
透明基板雷射垂直光型切割技術應用。



延伸閱讀
[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]