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工業技術研究院

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功能性薄膜披覆技術

技術簡介

自主開發ICP-PECVD電漿鍍膜設備技術,於單一腔體中連續製備SiOx:CH矽氧烷複合薄膜,同步達成具阻水氣(Barrier)、硬化(Hard Coating)與表面疏水(Hydrophobic)複合功能之保護膜,設備核心為低溫ICP高密度電漿模組,搭配Sheet Type及Batch Type為設備應用開發,以因應光電平面型及傳統產業3D不規則物件功能性薄膜披覆。

特色與創新

  • 單腔式製備SiOx:CH漸變複合保護膜。
  • 高阻水氣率薄膜封裝系統。
  • 低溫ICP高密度電漿鍍膜設備。

技術規格
  • 水滴接觸角:>100°。
  • Hard Coating:提升3個等級(裸材)。
  • 阻水氣率:WVTR≦5*10-5g/m2day(商用MOCON極限)。
  • 電漿製程溫度:<80°C。

應用與效益

高阻水氣軟板、OLED照明封裝、電子元件防水、傳產車燈鍍膜。

功能性薄膜披覆設備。
功能性薄膜披覆設備。

功能性薄膜披覆技術之效果。
功能性薄膜披覆技術之效果。



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