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工業技術研究院

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積層製造製程模擬與監控補償控制技術

技術簡介

建立台灣粉末燒熔製程模擬與監控補償控制技術能量,發展金屬積層製造off-line熔融製程模擬技術,縮短積層製造新材料製程參數開發時間,並藉製程預前模擬提供燒熔之修正控制參數,搭配In-line粉床監控系統之建立,提高設備智慧分析診斷能力,降低製作風險增加製作效能,並藉遠端多參數診斷預警與流程管控的實踐,確保產品穩定度及保留完整製程履歷,銜接未來數位化智慧製造工廠之整合與應用。

特色與創新

  • 燒熔製程模擬系統:採曲面輪廓度,形貌模擬輪廓符合公差圓Φ10µm範圍內。
  • 缺陷補償控制系統:250x250mm2範圍達到瑕疵解析度< 250 µm/pixel。
  • 粉床監控分析項目包括:
    -鋪粉後瑕疵:鋪粉不均勻、多重刮痕、供粉不足、雜質殘留。
    -燒溶後瑕疵:熔渣殘留、表面紋理、過熔起泡、應力翹曲、氧化變色。

應用與效益

  • 積層製造新材料開發,縮短製程參數收斂時間。
  • 積層製造新產品開發,預前評估提供設計修改建議與製做支撐參數建議。
  • 積層製造製程監控,減少產品製作品質問題,提高設備製造良率。
  • 可視化實踐與多資訊整合,未來將可與上下游設備串聯,實踐智慧製造工廠。
模擬模組。
模擬模組。



延伸閱讀
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