『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

振動感測模組

技術簡介

 振動感測模組
振動感測模組

感測器元件採用MEMS技術設計/製作,具備5kHz感測頻寬、數位式資料輸出。應用上,整合時域/頻域訊號整合分析系統,與振動訊號估測演算法之後端分析工具,提供客戶監控工具機設備在加工過程中所產生的振動,以提升加工穩定度、精度並增加設備之使用效率。

特色與創新

本技術具專利性結構設計與類比前端讀取電路與數位濾波校正電路,結合IP68等級之防水/塵/油污金屬封裝,可滿足眾多工業應用之導入。

技術特色
  • 單晶片中實現三軸向振動感測。
  • 抗應力與抗衝擊之創新結構專利設計。
  • 低雜訊類比前端(AFE)與調變電路。
  • 數位濾波與校正電路適應性自動增益驅動電路。
技術規格
  • 量測範圍:±2g(可客製化調整)。
  • Bandwidth:5kHz。
  • Noise:50 ug/rtHz。
  • 防水防塵:IP68 @Sealed Connector。

應用與效益

本技術可應用於主軸、滾珠螺桿、滑軌、工具機、高階CNC、鑽孔機、多軸機器人等設備之振動偵測。

振動感測模組
振動感測模組。
及時振動訊號介面
及時振動訊號介面。


延伸閱讀
[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]