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工業技術研究院

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雷射3D掃描量測技術

技術簡介

 雷射3D掃描量測技術。
雷射3D掃描量測技術。

以雷射掃描感測為核心技術,開發高速感測取樣控制技術、全域3D點雲空間重建技術以及線上3D輪廓掃描量測演算法技術,建構全自動化的非接觸檢測系統。

特色與創新

非接觸式的3D雷射掃描進行全區域多點量測,可高速擷取物體表面輪廓,實現形狀、方向、定位、偏轉度等快速3D量測。

技術特色
  • 適應:適用高反光金屬表面與高穿透性玻璃。
  • 彈性:取代客製化檢具,因應彈性換線需求。
  • 精準:量測演算技術榮獲PTB最高精度認證。
技術規格
  • 掃描量測速度:≧ 10 mm/s。
  • 深度量測重覆精度:≦ ±0.002mm ± 2.5℃。
  • 同步控制掃描速率:≧500 lines/sec。
  • 點雲資料處理量:≧1.5M pts。

應用與效益

可應用於玻璃面板、汽車零組件與航太零組件的量測,大幅提升品質檢測效率,填補國內3D檢測技術缺口,提供客戶一條龍式的完整解決方案。

(左)玻璃面板量測應用;(中)汽車零組件量測應用;(右)航太零組件量測應用。
(左)玻璃面板量測應用;(中)汽車零組件量測應用;(右)航太零組件量測應用。



延伸閱讀
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