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工業技術研究院

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面板級扇出型模組整合技術

 面板級扇出型模組整合技術。
面板級扇出型模組整合技術。

工研院研發之面板級扇出型模組整合技術,以現有載板面板尺寸及製程架構,跨領域整合扇出型(Fan-out)封裝設計及製程。協助產業升級的同時,更促成晶片載板2μm細線技術能力自主化。運用工研院扇出型封裝製程設計技術所建立之材料及製程驗證平台,已成功鏈結國內外廠商,協助臺灣晶片載板廠為客戶提供少量多樣的封裝製程服務、或與材料廠商進行扇出型模封材料的封裝驗證服務。



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