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工業技術研究院

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功耗與熱感知電子系統層級平台

技術簡介

 功耗與熱感知電子系統層級平台
功耗與熱感知電子系統層級平台

耗電與過熱是行動裝置系統晶片設計與製造之關鍵議題,降低耗電與過熱必須同時從架構、軟體、硬體、矽智財以及晶圓製造等層面進行整體考量,目前業界缺乏有效之平台整合工具。工研院基於電子系統層級平台技術(Electronic System Level,ESL),成功開發「功耗與熱感知電子系統層級平台」。

特色與創新

此平台技術藉由自主研發之電子系統層級功耗與熱分析介面專利技術,以及提升事務層級模型精確度與模擬速度之專利設計,可於晶片設計初期依據終端產品應用情境快速進行全系統分析,與傳統流程相比速度提升200倍以上,可協助設計團隊改善軟硬體架構,解決晶片耗電與過熱問題,提升產品競爭力。此技術已導入業界,更獲得2017全球百大科技研發獎。


功耗與熱感知電子系統層級平台(PDF)


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