工業技術研究院

技術簡介

現有電子與半導體製造廠之現址式洗滌器普遍存在粉塵捕集效率不足之問題，整體固態物去除效率DRE低於70％，導致尾氣由現址式洗滌器輸送至中央式洗滌器之管線易發生粉塵堆積與阻塞，進而增加設備維護頻率、維修成本及非計畫性停機風險。本技術透過縮減流道截面以強化氣流效應，結合水霧洗滌之高相對撞擊機制，有效提升細懸浮微粒捕集效率；另搭配環形氣流高溫火炬燃燒模組，可有效裂解化學物質效率達82.5％。系統整合高風量低壓損鼓風機設計，可在不增加既有排氣系統負荷下，大幅提升固態物去除效率，降低管線阻塞風險與維護人力成本，適用於半導體與電子製造廠現址式尾氣處理應用。

Abstract

Conventional local scrubbers used in electronic and semiconductor manufacturing facilities often suffer from insufficient particulate removal performance, with overall dust removal efficiency (DRE) typically below 70％. This limitation leads to particle accumulation and clogging in the exhaust pipelines between local scrubbers and central scrubbers, resulting in increased maintenance frequency, higher operational costs, and unplanned downtime. This technology presents a locally integrated wet scrubber-based particulate capture module, which enhances fine particle removal by reducing flow cross-sectional area to intensify turbulent flow and combining high-impact water-spray scrubbing. In addition, it is equipped with a ring airflow high-temperature plasma torch combustion module, which can effectively crack chemical substances with an efficiency of 82.5％. The system is further optimized by integrating a high-flow-rate, low-pressure-loss blower to compensate for system pressure drop, thereby improving solid particle removal efficiency without imposing additional burden on existing exhaust systems. As a result, the proposed system effectively mitigates pipeline clogging risks, reduces maintenance labor requirements, and improves operational reliability in semiconductor and electronic manufacturing exhaust treatment applications.

技術規格

系統配置大小為8500 mm ×8800 mm ×1600 mm，環形氣流高溫火炬燃燒模組，有效裂解化學物質效率達82.5％。微粒水洗捕集模組可客製化調整容積，乾式、濕式兩用，PM2.5 捕集率91％。

Technical Specification

The system configuration size is 8500 mm ×8800 mm ×1600 mm. The annular airflow high-temperature plasma torch combustion module has an effective cracking efficiency of 82.5％ of chemical substances. And the volume of particulate matter dust capture module can be customized and adjusted, it can be used in both dry and wet types, and the PM2.5 capture rate is 91％.

技術特色

本技術之特色在於針對現址式洗滌器固態物去除效率不足之產業痛點，透過流道幾何優化提升氣流湍流強度，強化粉塵微粒與水霧間之相對撞擊效率，以提高細懸浮微粒捕集能力。另透過蛇盤式電極結構產生螺旋電弧放電，完成建立低耗能電漿火炬、裂解化學物質效率DRE達82.5％。系統搭配高風量低壓損鼓風機，可有效補償粉塵捕集模組所產生之系統壓損，使整體尾氣處理流程維持穩定運轉。相較傳統洗滌設備，本技術可顯著降低粉塵於管線內沉積與阻塞情形，減少維護頻率與停機時間，進而降低廠商營運成本與人力負擔，具備高度工程化與產業導入潛力。

應用範圍

光電半導體廠尾氣微粒捕集，local scrubber燃燒與水洗段

接受技術者具備基礎建議（設備）

排氣系統、水洗系統、高壓電源供應系統

接受技術者具備基礎建議（專業）

需具備有電控與機械經驗之開發人員

聯絡資訊