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Industrial Technology Research Institute

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The Industrialization of 3D Electric Circuits for High-Frequency Telecommunications

Technology Overview

The Industrialization of 3D Electric Circuits for High-Frequency Telecommunications.
The Industrialization of 3D Electric Circuits for High-Frequency Telecommunications.

While telecommunication equipment manufacturers rush to produce products with smaller sizes, narrow bezels and multifunctional antennas, surface adhesion problems in 3D electric circuit production remain unsolved. ITRI has developed multi antenna 3D multi-input multi-output (MIMO) technology for the manufacture of 5G products with a high screen ratio, assisting businesses in applying this technology in their production of laptop frames. The screen ratio of laptops has increased from 82% to 95%, while notebooks are becoming capable of transferring data at a speed up to gigabits per second. Meanwhile, ITRI has been working with major international manufacturers to develop 3D wall-embedded PTFE cables for high-frequency 5G telecommunications, which helps increase data transfer efficiency by 20% and reduce device thickness by 50% (< 0.4 mm). ITRI is also cooperating with prominent international glass manufacturers to create a 28 GHz MIMO antenna module for 5G networks.

Applications & Benefits

This technology received the 2019 National Industrial Innovation Award, the Technical Achievement Award, and the Technology Management Award.