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Industrial Technology Research Institute

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Additive Process for Fine–Line Circuit Fabrication

Technology Overview

Additive Process for Fine–Line Circuit Fabrication.
Additive Process for Fine–Line Circuit Fabrication.

To meet the needs of fine line minimization and green production processes for electronic products, ITRI has developed “precursor–triggered transfer colloid”, “ultra–fast laser processing high aspect ratio gravure mold”, and “high-precision imprinting equipment” technologies.

Through the processes of printing, colloid activation, and metallization, ITRI can fabricate patterned circuit lines on substrates down to a minimum 3μm width. The electrical property of such lines achieves the level of pure copper, while the maximum process temperature is only 60°C. The technology has overcome the limitation of poor electrical properties in current printing technology with small line width, and improved the environmental problems of high energy consumption and high pollution resulting from the traditional photolithography process.

An industrial R&D alliance has been founded to develop the key components and production process for flexible substrate with additive roll–to–roll fine–line circuits. In addition, for equipment, materials, molds, and trial-production technology development, ITRI has built a 100% domestic fabrication supply chain for additive fine–line circuits.

Applications & Benefits

ITRI has cooperated with many well–known international companies to develop advanced glass manufacturing processes for high–frequency antennas and electrostatic dust screens. In the meantime, it has been integrating global advanced materials and components for application in the high–frequency substrates process.