Heterogeneous Package Pilot Production Service Flow
Heterogeneous Package Pilot Production Service Flow.
ITRI Heterogeneous Package Pilot Line provides wafer-level advanced packaging rapid prototyping service. ITRI uses the developed 12” wafer-level package process and facility, chip-to-wafer and wafer-to-wafer hybrid bonding, face-to-face chip integration, embedded package, and Nano-twinned Cu technologies to help industrial partner to develop high-quality and high-precision heterogeneous package products to respond multiple applications like IoT, Beyond 5G communication, Datacenter, High frequency radar, Intelligent automotive electronics and many more.