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Industrial Technology Research Institute

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Heterogeneous Package Pilot Production Service Flow

Heterogeneous Package Pilot Production Service Flow

Heterogeneous Package Pilot Production Service Flow.
Heterogeneous Package Pilot Production Service Flow.

ITRI Heterogeneous Package Pilot Line provides wafer-level advanced packaging rapid prototyping service. ITRI uses the developed 12” wafer-level package process and facility, chip-to-wafer and wafer-to-wafer hybrid bonding, face-to-face chip integration, embedded package, and Nano-twinned Cu technologies to help industrial partner to develop high-quality and high-precision heterogeneous package products to respond multiple applications like IoT, Beyond 5G communication, Datacenter, High frequency radar, Intelligent automotive electronics and many more.