Technology Overview
High Aspect Ratio Copper-Filled TGV Technology.
Copper-Filled Through-Glass Via (TGV) technology faces challenges in hole filling uniformity, yield, and electroplating efficiency, affecting packaging performance and cost control. To meet the demands of the high-end packaging market, ITRI has developed an 8-inch wafer level Copper-Filled TGV Technology with a high aspect ratio of 10:1, hole diameter of 30 μm, and thickness of 300 μm. The AI-CSR algorithm shortens electroplating bridging time from one hour to 40 minutes and increases the copper filling yield to 97.9%, significantly improving process efficiency and product stability.
Applications & Benefits
ITRI has also advanced the development of all-wet processes, materials, and equipment to provide comprehensive packaging solutions. Meanwhile, ITRI collaborates with technology alliances to seek global partnerships, upgrade technology capabilities, and increase international competitiveness.