Technology Overview
Bessel Beam Module for TGV Drilling
To meet the demands for high-speed computation and low loss in high-frequency communications, ITRI has developed the diffractive Bessel beam module for TGV drilling, significantly reducing residual stress and microcracks to improve TGV roundness. This technology minimizes spot size and achieves a z-axis laser energy homogeneity of 72%, enabling a TGV diameter reduction to 7.9 μm and an aspect ratio increase to 25.
Applications & Benefits
ITRI has an on-going tripartite technical cooperation with Contrel Technology Co. and Innolux to establish a TGV process and verification platform at ITRI. This platform can test and verify advanced 3D IC chip packaging requirements and accelerate Taiwan's entry into the global supply chain. ITRI has also collaborated with Contrel and Unimicron Technology Corporation on micro glass cutting, drilling of optical communication substrates, and μLED panel cutting, expanding applications of Bessel beam design and TGV technologies.