Technology Overview
MOSAIC, Memory-Cube Operability in a Stacked AI Chip for Generative AI.
ITRI has partnered with the industry to develop MOSAIC, a one-stop design and manufacturing service for logic and memory that includes vertical integration of innovative AI computing framework and memory design. The development of flexible, energy-efficient, and low-power chips greatly reduces the high energy consumption associated with Gen AI’s computational demands. MOSAIC utilizes wafer-level, high-density 3D chip stacking technology to break through the memory wall limitation between multi-core processors and largecapacity memory, enhancing data transfer bandwidth and reducing the transmission distance between chips from micrometers to nanometers. Compared to similar AI products, it consumes only 1/10 of the energy while achieving the same computational efficiency.
Applications & Benefits
MOSAIC features a customizable, selectable DRAM capacity with variable data transfer rates, making it suitable for various core configurations and high-speed memory access in 3D chip solutions. This creates a new business model for expanding 3D AI chips with low-cost, highly flexible product design in both computing and storage. The technology won a 2024 R&D 100 Award.