Technology Overview
Precision Thermal Control and Energy-Saving Technology.
Thermal stress imbalances inadvanced semiconductor packaging processes can lead to structural warping and delamination, resulting in material waste. The 3D+IR Precision Thermal Control Technology utilizes non-contact thermal imaging and intelligent 3D thermal field correction to provide comprehensive thermal field information and overcome the limitations of traditional singlepoint thermocouple measurements. This technology enables real-time, precise temperature sensing and uniform heating control, significantly reducing defect rates, energy consumption, and carbon emissions. It has been implemented in CoWoS and FOPLP processes to enhance the temperature uniformity and operational performance of the thermal processing equipment, with a 15%-30% reduction of carbon emissions.
Applications & Benefits
The technology helps industry players launch new products while ensuring compliance with international low-carbon regulations, such as the EU's Carbon Border Adjustment Mechanism (CBAM) and the US' Clean Competition Act (CCA).