Technology Overview
Transmission Optical Inspection Technology enhances PA process stability and mass production reliability.
The expansion of 5G, LEO satellites, and Wi-Fi 7 applications is fueling demand for power amplifiers (PAs). To meet high-frequency, high-power, and miniaturization requirements, PAs increasingly adopt compound semiconductors and 3D recessed conductive structures. These wafer-embedded structures are prone to variations in lithography exposure energy, which can cause defects such as structural collapse and bridging shorts. Conventional scanning electron microscope (SEM) inspection is destructive and limited to offline sampling, while existing optical inspection suffers from shadowing and reflection interferences, producing blurred images. This creates an urgent need for in-line, real-time, high-precision inspection and metrology.
Applications & Benefits
The Transmissive Optical Inspection Technology integrates dynamic fusion imaging with a deep learning AI model for analysis and error correction. This non-contact, inline, and real-time solution reconstructs images of internal wafer structures within 15 seconds. The technology delivers 0.3 μm measurement precision and resolves traditional shadowing effects. It allows equipment manufacturers to detect defects early, enhance PA process stability and mass production reliability, and strengthen the competitiveness of Taiwan-made semiconductor equipment.