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工業技術研究院

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超細微導線軟板

技術簡介

 工研院自主開發凹板轉印製程技術及銅還原製程技術,使其可直接於PI或PET等基板表面製作圖案化細微線路,其最小線寬可達3 µm且具高導電特性。本技術將有機會取代傳統黃光蝕刻製程,以較環保的凹版轉印製程技術量產軟性印刷電路板,並可將製程由7道簡化為2道與減少約30%排碳量。
工研院自主開發凹板轉印製程技術及銅還原製程技術,使其可直接於PI或PET等基板表面製作圖案化細微線路,其最小線寬可達3 µm且具高導電特性。本技術將有機會取代傳統黃光蝕刻製程,以較環保的凹版轉印製程技術量產軟性印刷電路板,並可將製程由7道簡化為2道與減少約30%排碳量。

工研院自主開發凹板轉印製程技術及銅還原製程技術,使其可直接於PI或PET等基板表面製作圖案化細微線路,其最小線寬可達3 µm且具高導電特性。

特色與創新

目前國內軟性電路板遭遇之問題為蝕刻線寬無法小於20μm(undercut、良率下降等)及黃光蝕刻製程生產成本過高、高耗能與產生污染等問題。本技術將有機會取代傳統黃光蝕刻製程,以較環保的凹版轉印製程技術量產軟性印刷電路板,並可將製程由7道簡化為2道與減少約30%排碳量。








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