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工業技術研究院

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三維積體電路研發實驗室

是亞洲首座擁有完整12吋3DIC核心製程--矽基板穿孔(Through-Silicon Via,TSV)及三維晶圓堆疊整合的研發實驗室,以開發3DIC核心技術為基礎,整合EDA、IC設計、製造、封裝到試量產完整製程,是一個開放合作的國際化研發平台。

3DIC實驗室
3DIC實驗室
薄化晶圓
薄化晶圓


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