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工業技術研究院

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光傳輸-矽光子積體化技術

技術簡介

在物聯網、5G、AI等應用推動下,後端的數據中心將承擔龐大資料量,傳統纜線的電信號傳輸已不敷使用,光傳輸產品滲透率將大幅上升,工研院積極開發高速與低成本的矽光子積體化技術,將各種光傳輸元件製作於矽光子平台,其產品特點在量大、產值高、成本低。

特色與創新

工研院發展矽光子傳輸晶片之關鍵技術,包括元件設計、製程整合、光學封裝及光電測試技術,搭配國內產學界於各主動與被動元件之技術優勢,目標為單通道100Gb/s之多通道光收發模組,期望藉由台灣光電產業在三五族磊晶、精密製程與組裝,結合IC半導體產業在設計、製造及封測的優勢,建立次世代高速、低成本之光傳輸矽光子積體技術與產業鏈,開拓產業創新與競爭力。

光傳輸-矽光子積體化技術。
光傳輸-矽光子積體化技術。



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