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工業技術研究院

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技術名稱: LED光引擎射出封裝技術

技術簡介

本技術採用射出封裝技術縮短積體化的一次光學封裝成本與時間。以往積體化光引擎技術需要將光源與電子元件打件之後,結合二次光學元件進行光輸出的光形調控。以此架構雖然可以因應後續不同應用而更換二次光學,但是在嵌燈的照明應用中,絕大部分安裝後不會再進行光學設計變更。因此,如果能夠在製造過程中,直接完成所需的光形設計,而省去二次光學的流程,除了減少二次光學的光學損失與成本之外,更可以縮短製造時間,因此本計畫使用反應式射出封裝技術,並且導入光引擎的設計開發,最終完成了射出雛形品的製作。

Abstract

In this study, the injection molding technology is used in the fabrication of LED light engine. Usually, the second lens is needed after the surface mount technology process of the LED package and other components to control the beam angle. However, the second optics on the module can be changed for different applications, but not for the recessed lamp. Therefore, the idea of the integration of optics and package is applied on the LED light engine, injection molding, to avoid the optical loss and cost. Finally, the narrow beam angle of the LED package on the LED light engine by the reaction injection molding process is achieved.

技術規格

混合比例(A/B):100/100、標準固化條件:100C 1h+150C 3h、折射率:1.41、硬度(A):70、透光率(400nm~2mm)%:90

Technical Specification

Blending ratio(A/B):100/100、Standard Curing Condition:100C 1h+150C 3h、Refractive index:1.41、Hardness(A):70、Transmittance (400nm~2mm)%:90

技術特色

1.熱固形微結構射出成型技術已可少量客製化製作。 2.微結構成型機內建訊號自動監控機制,紀錄容量可至10,000組。 3.活塞擠壓塑料射出,單次最小射出量可達0.1g。 4.可抽換式模仁設計,提升替換便利性並降低模具元件成本。 5.機台可整合資料網路存取,未來可結合雲端提升產品競爭力。

應用範圍

精密醫療產業、精密光學、科技半導體、消費電子、航太電子、...等各種工業周邊製程精密3D射出成型相關需求業者。

接受技術者具備基礎建議(設備)

精密微流道射出成型、半導體微電子產品生產、精密機械製造、檢測與維修設備,微流道儀表產品相關校驗設備。

接受技術者具備基礎建議(專業)

具備電子、電信、電機、資工、儀表領域研發工程人員與銷售業務。

技術分類 02 D照明節能

聯絡資訊

聯絡人:崔智宣 智慧節能系統技術組

電話:+886-3-5914983 或 Email:trigg@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5910155

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