工業技術研究院

技術簡介

建立濕式製程設備厚度校正關鍵技術，整合銅離子耗損分析、傳動張力與轉速即時監控、膜厚預測模型、自動補液校正等模組技術，透過預測結果調整優化設備參數，達成沉積銅厚度比對預估誤差＜15％。

Abstract

Develop key technologies for thickness calibration in wet process equipment by integrating modular technologies such as copper ion consumption analysis, real-time monitoring of transmission tension and rotation speed, film thickness prediction models, and automatic replenishment calibration. By adjusting and optimizing equipment parameters based on prediction results, achieve a deposition copper thickness estimation error of less than 15％.

技術規格

提升沉銅設備之產品良率及降低依賴資深員工消耗的時間與人力成本，達成設備厚度比對誤差10％

Technical Specification

Enhance the product yield of electroplating equipment while reducing reliance on senior staff time and labor costs, achieving an equipment thickness comparison error of less than 10％.

技術特色

導入廠商產線製程藥液，進行鍍液壽命與厚度誤差測試驗證改善，延長鍍液壽命25％、產品沉積銅厚度誤差10％

應用範圍

PCB產業、濕式製程設備製造業

接受技術者具備基礎建議（設備）

個人/工業電腦、感測器、網路環境、關聯式資料庫、伺服器

接受技術者具備基礎建議（專業）

1.具備電化學與金屬沉積相關知識 2.自動化軟體撰寫 3.機電整合測試

聯絡資訊