工業技術研究院

技術簡介

共光路技術整合2D顯微及3D干涉，可做同一視野2D/3D即時分析。以多站合一減少檢測時間，解決多站重複傳輸重新對位問題，且可降低設備成本。

Abstract

"The common-Optical path design integrates 2D microscope and 3D interference, accomplish 2D/3D real-time analysis in the same field. Single-station that combines multiple station into one, can reduces detection time, solves the problem of repeated transfer and re-alignment of multiple stations, and can reduce equipment costs. This technology can be applied to field monitoring of advanced packaging of critical dimensions and layer offset"

技術規格

同一視野2D/3D即時檢測分析(1)2D顯微-檢測尺寸、缺陷 (2)3D干涉-檢測高度及粗度

Technical Specification

(1)Real-time detection analysis in the same field of view for 2D microscopy - dimension ＆ defect detection (2)3D interferometry - height and roughness measurement

技術特色

可應用於CoWoS及FOPLP等製程

應用範圍

本技術可應用於先進封裝形貌關鍵尺寸、疊層偏移等場域監控

接受技術者具備基礎建議（設備）

模組需安裝至花崗岩VCC等級防震平台

接受技術者具備基礎建議（專業）

設備整合測試

聯絡資訊