『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: sPS複合材於通訊基板與製程之開發

技術簡介

本計畫分為五大項工作進行(a)高溫膠的放大製備技術、(b)sPS配料之研究、(c)sPS與銅箔之接著研究、(d)基板的壓合研究和(f)sPS熱熔預浸材押出製程技術及模具製造技術。當添加耐熱極性苯乙烯共聚合物,可提昇sPS樹脂與銅箔和玻璃布之接著性,且保有良好之介電特性,FY88完成sPS預浸材及基板製程開發。

Abstract

.

技術規格

(a)融熔連續製程,預浸材速度1.0m/min,可通過浸錫爐288℃,60sec。 (b)空孔率<3% (c)介電常數< 3.0 (at 10GHz) (d)消散因子< 0.01 (at 10GHz) (e)Peel strength > 5.5lb/in (銅接著性) (f)CTE(z) < 35ppm

Technical Specification

.

技術特色

1.經高分子結構設計,添加耐熱極性苯乙烯共聚合物,不但可平衡其電氣性質且可提昇接著力。 2.基板製程,經模具設計,可提昇玻纖之預浸程度。

應用範圍

通訊印刷電路板、樹脂、配料加工業。

接受技術者具備基礎建議(設備)

需備有押出機,預浸機,模壓機。 參考資料 1.US Patent 4853423 2.US Patent 5043367 3.US Patent 5718789 4.Bicerano, J., "Predication of Polymer Properties", Marcel Dekker, New York (1993).

接受技術者具備基礎建議(專業)

需有配料設計,電路基板領域人才。

技術分類 高分子材料

聯絡資訊

聯絡人:陳建明 高分子研究組

電話:+886-3-5732483 或 Email:JeremyChen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5732347

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]