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工業技術研究院

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技術名稱: IC及LED熱阻量測技術

技術簡介

電子元件體積愈來愈小,而單位體積的熱量急速增加,為避免因熱而失靈,故必須了解電子構裝之散熱能力,因此應用溫度敏感參數原理來校正與量測相關之電壓降(Voltage Drop),再轉換為元件實際之熱阻。

Abstract

Electronic device trends to small size. The power density increases rapidly. To avoid to the device failure, we must understand the thermal performance of IC package. This technology uses the temperature sensitive parameter to correlate the valtage drop, and then transforms to thermal resistance.

技術規格

依循 JEDEC Standard、SEMI Standard

Technical Specification

Follow JEDEC Standard、SEMI Standard

技術特色

依循 JEDEC Standard、SEMI Standard,國內自行開發完成之電子構裝元件熱阻量測技術。

應用範圍

電子構裝元件之熱阻量測 .自然對流熱阻量測 .強制對流熱阻量測

接受技術者具備基礎建議(設備)

構裝廠、或IC廠封裝部門、或專業量測服務公司

接受技術者具備基礎建議(專業)

.熱傳學基礎 .電子封裝基礎

技術分類 量測分析

聯絡資訊

聯絡人:陳文峰 企畫與推廣組

電話:+886-3-5913314 或 Email:chented@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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