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工業技術研究院

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技術名稱: 厚膜光阻製程技術

技術簡介

厚膜光阻主要用來產生high aspect ratio (高深寬比)的結構,厚膜光阻作出結構後,再加上後續的電鑄製程,便可以用來製造如齒輪、線圈、微流道,或可以用來作為Deep Si RIE的Mask材料。

Abstract

Thick photo-resist can fabricate high-aspect-ratio structure.In combination with electroforming micro gears and coils can be fabricated.The structure itself can be micro channel or masks for deep etchinh.

技術規格

正光阻 : 光阻厚度 ~ 20um, 深寬比~1.5 負光阻 : 光阻厚度~ 200um, 深寬比~1.5

Technical Specification

Positive PR : PR thickness ~ 20um, Aspect ratio~1.5 Negative PR : PR thickness ~ 200um, Aspect ratio~1.5

技術特色

高深寬比結構。

應用範圍

Bump Fabrication, Wire Interconnect, High Aspect Ratio Structure.Bio chip,Inkjet Head,Plannar light circuit.

接受技術者具備基礎建議(設備)

參考資料:(如國際會議發表情形或智慧財產權已獲取情形…等) 熱墊板,曝光機

接受技術者具備基礎建議(專業)

熟悉黃光單站製程。

技術分類 製程

聯絡資訊

聯絡人:曾育潔 智能應用微系統組

電話:+886-3-5913068 或 Email:jackietseng@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5917193

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