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工業技術研究院

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技術名稱: 合金複合電鍍/電鑄技術

技術簡介

利用無電鍍鎳/無電鍍銅方式選擇性地在底材上進行金屬化,藉由穩定的參數控制達到一定厚度,以滿足功能性的需求。

Abstract

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技術規格

Ni厚度5-20μm for UBM

Technical Specification

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技術特色

可依產品需求調整相關參數

應用範圍

CPS構裝用凸塊製作之UBM、鎂合金電鍍、鋁合金電鍍、PI/BCB線路分佈

接受技術者具備基礎建議(設備)

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接受技術者具備基礎建議(專業)

具表面處理經驗或化學、化工

技術分類 金屬材料

聯絡資訊

聯絡人:陳興華 金屬材料研究組

電話:+886-3-5915233 或 Email:edwardchen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820259

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