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工業技術研究院

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技術名稱: Low DK積板材料開發

技術簡介

利用低介質常數之PPE樹脂改質環氧樹脂材料並導入BMI材料,達到低介質常數與高Tg之材料特性,將傳統電路基板材料等級提升,建立自主高級基板材料,可適用於高頻基板之應用。目前達到之材料特性:Peel strength 7.1 lb/in,Tg(TMA) 178.3℃,Dk(1MHz) 3.96,Df(1MHz) 0.0073,Water Asorption 0.36%,耐燃性通過UL94-V0標準。

Abstract

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技術規格

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Technical Specification

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技術特色

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應用範圍

高頻通訊用基板、IC構裝用載板

接受技術者具備基礎建議(設備)

反應器、含浸機、壓合機、電路板測試設備

接受技術者具備基礎建議(專業)

1.高分子合成技術 2.電路板製程技術

技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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