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工業技術研究院

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技術名稱: 軟性基板材料開發與應用

技術簡介

利用配方技術並搭配精密塗佈技術,連續製造基板材料,在材料特性及加工特性上均有特色。目前達到之材料特性:介電常數(1MHz) 3.22,吸水率0.97% ,Tg 367℃,接著力>6lb/in。與國外主要競爭對手—日本之新日鐵公司產品比較,在介電常數及吸水率部份接較其優異。(新日鐵產品:介電常數= 4.1,吸水率= 2.7%)。

Abstract

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技術規格

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Technical Specification

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技術特色

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應用範圍

FPC產業、TAB及CSP基板材料、LCD構裝用之COF基板材料。

接受技術者具備基礎建議(設備)

反應器、連續式塗怖機、高溫硬化爐、軟板測試設備。

接受技術者具備基礎建議(專業)

1.高分子合成技術 2.連續式塗佈技術

技術分類 電子有機材料

聯絡資訊

聯絡人:金進興; 劉淑芬 電子材料及元件研究組

電話:+886-3-5916929;+886-3-5916853 或 Email:AlexKing@itri.org.tw; ShurFenLiu@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820206

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