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工業技術研究院

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技術名稱: 積層電源模組製程技術

技術簡介

一般電腦、資訊、通訊及其週邊產品,都必須透過直流-直流轉換器(DC-DC Converter)將外部電源轉換為系統所需之多種工作電壓,薄型、高密度、低EMI及高效率為其設計重點。將整個模組積層化-將積層電感、積層電容、電阻、佈線層及半導體整合為立體化的三次元結構,此結構可提高工作頻率、效率及功率密度而無EMI問題,大幅縮小電源供應器的體積及厚度,十分適合目前電子產品高度集積化的走向。

Abstract

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技術規格

昇降壓型電源模組,工作頻率=500~1250kHz,最大輸出功率~20W以上,效率>85%,功率密度30~60W/cm^3以上,溫昇<80℃。含電磁路設計,材料技術及積層製程技術。

Technical Specification

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技術特色

以多層陶磁結構的電路╱磁路整合模組,涵蓋電磁路設計、熱傳、異質介面、陶磁材料低溫共燒等材料技術。

應用範圍

電子資訊及通訊產品如數位相機、無線通訊產品、LCD 顯示器、PDA及筆記型電腦等小型化可攜式產品。

接受技術者具備基礎建議(設備)

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接受技術者具備基礎建議(專業)

材料、電力電子、陶瓷、物理、化學背景

技術分類 無機材料

聯絡資訊

聯絡人:唐敏注 電子材料及元件研究組

電話:+886-3-5916901 或 Email:MJTung@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820206

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