工業技術研究院

技術簡介

因應未來幾年電子元件等相關產業散熱議題，提供較現行熱管更高傳熱特性、更具彈性化之散熱模式，解決產品因熱所導致性能、可靠度等相關問題。與傳統熱管同屬被動式傳熱元件且有相同運作原理，較大差異處為工作流體處於汽液分離，故具較大熱傳輸能力且應用設計時有著彈性化，距離遠…等特性。

Abstract

With ever increasing power densities at both the component and board level in the near future, are searching for emerging cooling solutions with more power dissipation ability, flexible design, and high reliability. Loop heat pipe!|s technology offer the opportunity for an integrated thermal system which is passive, modular, flexible, and which allows appropriate treatment for both high power and modest loads. Because of much smaller pore size than a traditional heat pipe, increasing the capillary pressure and the ability to work in all orientations. This capillary pressure allows the loop heat pipe to pump fluid long distance.

技術規格

－蒸發端區域與冷凝端區域：45×45×3 mm (依據散 熱需求增大或縮小) －傳輸距離30 cm

Technical Specification

Evaporation and condenser zone: 45!N 45!N 3 mm (depends on heat transport capacity) Transport length: 30 cm

技術特色

.傳輸距離遠 .極佳熱傳能力 .可撓曲且設計彈性 .重力影響小 .被動傳熱元件

應用範圍

-筆記型電腦(預估3000萬台以上--2003年) -其他電子元件散熱(PDP TV…) -車用電子，熱交換器、熱回收裝置 -航太軍事裝置與機械零組件散熱…

接受技術者具備基礎建議（設備）

(銅)金屬焊接設備，熱管製作裝置

接受技術者具備基礎建議（專業）

機械工程等相關背景人員。

聯絡資訊