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工業技術研究院

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技術名稱: 焊點可靠性評估技術

技術簡介

1. 提供廠商焊點可靠性評估技術現況與發展、測試方法原理之教育訓練及技術輔導與咨詢服務。 2. 協助建立焊點可靠性評估之電腦模擬及測試結果資料庫。 3. 藉由焊點破壞模式之分析與探討,建立改善焊點可靠度之能力。

Abstract

1.Training course for solder joint reliability evaluation. 2.Stress simulation for solder joint life prediction & solder joint reliability evaluation testing data base. 3.Failure mode analysis and improvememt of solder jont reliability.

技術規格

MIL-883D

Technical Specification

MIL-883D

技術特色

1.焊點可靠度完整測試評估及資料分析 2.應力模擬分析及焊點可靠度壽命預測 3.焊點可靠度最佳化設計

應用範圍

  現今電子產品皆以焊點為組裝方式,而台灣以發展自有品牌及提高代工技術水準為目標,因此焊點可靠度評估技術,已經是國內上中下游相關電子產業必備的技術。目前焊點可靠度評估技術的需求,已經從封裝廠對本身封裝產品的焊點可靠度評估,擴散到上游IC設計、代工廠及下游的電子系統廠,所以幾乎全台灣甚至全球的電子產業都需要此一技術,正因為如此,相關市場規模與潛力之大無庸置疑。 誰能儘早準備就緒,提高自身競爭力,誰就能掌握市場先機,增加增取訂單之籌碼。因此國內廠商更應積極準備好相關焊點可靠度評估技術之能力。

接受技術者具備基礎建議(設備)

資料擷取系統 (Data Acquisition System) Weibull Distribution Analysis Sofware

接受技術者具備基礎建議(專業)

1.基礎統計 2.應力分析

技術分類 量測分析

聯絡資訊

聯絡人:陳文峰 企畫與推廣組

電話:+886-3-5913314 或 Email:chented@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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