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工業技術研究院

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技術名稱: 3D基板式堆疊構裝技術

技術簡介

以Solder Ball為Interconnection的3D堆疊構裝,可有效益的整合不同功能的晶片於同一構裝模組中,不僅能大幅減少電子構裝的尺寸,更能達到System in Package (SiP)的效能。此外,藉由Thermal Via、Thermal Ball及外露銅箔層的整合散熱設計,可使3D堆疊構裝的散熱效能,大幅提升。創新的可靠度測試設計,能同時評估Component Level 及Board Level的可靠度。

Abstract

Using solder ball as interconnection for 3D stacked package can increase the performace of system in package. BTW, thermal via and special heat sink design will increase the thermal performance.

技術規格

1.Through-Si方式達成晶片與晶片間之訊號傳遞 2.一步成型式導通孔技術

Technical Specification

1.Using through-Si method to transfer signals between chips. 2.One step package through-Si technology.

技術特色

1.Soc成本居高不下, 研發速度緩慢, 而sip成本低, 研發速度快, 3D構裝是其中重要的一環。 2.ASE, SPIC等大廠均在大力投入3D構裝, 但主要仍以打線為主。未來面對高階產品則將會採用導通孔3D構裝技 術。

應用範圍

隨著System in Package的技術發展趨勢日漸重要,3D堆疊構裝的技術,日益受電子產品市場的矚目。

接受技術者具備基礎建議(設備)

Flip chip bonder Reflow oven

接受技術者具備基礎建議(專業)

覆晶組裝製程技術

技術分類 系統

聯絡資訊

聯絡人:溫國城 企畫與推廣組

電話:+886-3-5915654 或 Email:kcwen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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