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工業技術研究院

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技術名稱: 射頻內藏被動元件之模型程式庫技術

技術簡介

  應用高介電係數(Hi-Dk, Dk>38@6.0GHz)基板材料與傳統FR4 PCB基板壓合,開發射頻(6.0GHz)內藏被動元件基板結構模型技術,包括基板內藏電容、基板內藏電感、內藏被動元件及寄生元件模型(Modeling)、被動元件程式庫(Library)、射頻基板材料評估與量測驗證。

Abstract

We use the high dielectric constant material (Hi-Dk, Dk>38@6.0GHz) and FR4 to laminate forming a functional substrate. We develop new technology to model embedded passive of RF band (6.0GHz) for the functional substrate. The new technology includes: the model of embedded passive components (capacitor and inductor); library of basic embedded passive element model; simulation and measurement technology for RF band.

技術規格

1.Specification of Embedded inductor and Embedded capacitor (Frequency 6GHz) ITEM Specification Tolerance Embedded inductor 1nH ~27nH <20 % Embedded capacitor 1 pF~54pF <20 % 2.Material specification and structure of

Technical Specification

1.Specification of Embedded inductor and Embedded capacitor (Frequency 6GHz) ITEM Specification Tolerance Embedded inductor 1nH ~27nH <20 % Embedded capacitor 1 pF~54pF <20 % 2.Material specification and structure of

技術特色

開發射頻內藏被動元件基板結構設計,包括內藏被動元件結構、內藏被動元件及寄生元件模型、元件程式庫、射頻基板材料評估應用與量測驗證,內藏被動元件射頻藍芽模組驗證。建立隨尺寸變化(Scaling Model)之傳輸線高頻模型(SPICE model),調適出spice model,調適頻率至3GHz,傳輸線實際量測與模型的誤差為小於0.5%,可以供2.4GHz射頻模組內藏被動元件傳輸線類比電路模擬使用。 特性:工作頻段:2.4GHz 基板材料:Hi-Dk(εr≧38) embedded into FR-4 多層(Multi-Layer) 內藏被動元件的功能性基板 內藏被動元件(non-solid plane built-in capacitor)之射頻模型與元件資料庫

應用範圍

  資訊電子產品的發展,為提昇效能均已朝向數位高速化、類比高頻化發展;另一方面,消費性電子產品亦走向多功能與輕、薄、短、小之趨勢,特別是可攜式無線通訊之電子產品,例如Bluetooth、Wireless Lan、Cellular Phones等;其硬體元件均需使用為數眾多之被動元件,依據評估統計無論是手機或是單晶片的藍芽模組等射頻模組,其被動元件數量約佔系統全部元件的75%以上;將為數眾多之被動元件整合在印刷電路板(PCB)中,藉以大幅提升印刷電路板之密度,深具市場應用潛力。 各公司除了自行研發或尋求國

接受技術者具備基礎建議(設備)

. 個人電腦(CPU:1GHz以上;RAM:256MB以上) . 高頻高階電磁模擬軟體(如:Sonnet 或 HFSS…) . 高頻網路分析儀(6GHz以上,如:Agilent 8510C) . 晶圓級量測平台(6吋以上,probe station)

接受技術者具備基礎建議(專業)

. 電子電路學 . 電磁學 . 高頻微波電路

技術分類 產品、製程

聯絡資訊

聯絡人:陳文峰 企畫與推廣組

電話:+886-3-5913314 或 Email:chented@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820412

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