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工業技術研究院

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技術名稱: 微孔電鑄成型技術

技術簡介

精密微孔電鑄成型技術可達厚度,均勻度80﹪以上(10cm×10cm)。開口孔徑公差±2μm,厚度可依產品規格調整。

Abstract

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技術規格

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Technical Specification

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技術特色

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應用範圍

噴墨頭用之噴孔片、醫療用之過濾片、電池用之金屬網篩、微機電及半導體封裝。印刷用網板(Stencil),蒸鍍用金屬罩(Metal Mask)。

接受技術者具備基礎建議(設備)

黃光設備、電鑄槽、孔徑檢測機及分析儀(鍍液成份)。

接受技術者具備基礎建議(專業)

電化學、曝光顯影經驗。

技術分類 金屬材料

聯絡資訊

聯絡人:陳興華 金屬材料研究組

電話:+886-3-5915233 或 Email:edwardchen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820259

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