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工業技術研究院

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技術名稱: 埋入式電容(Dk=40)基板材料技術

技術簡介

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Abstract

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技術規格

◎高介電基板材料之Dk值須≧40 ◎高介電基板材料之Df值須<0.04 ◎高介電基板材料可通過電路板製程之驗證

Technical Specification

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技術特色

使用有機/無機材料混成技術,製得之高介電配方材料再經精密塗佈技術製作基板材料,所得基板材料再進行物性與電性之驗證與測試,測試結果證實所研製之高介電基板材料,其介電常數(Dk)為40,且具有高Tg與銅箔接著良好。可通過PCB製程與最終特性之需求。

應用範圍

藍芽模組、無線通訊網路

接受技術者具備基礎建議(設備)

常溫反應器及分散設備、高分子熱、電與機械特性分析儀器、精密塗佈機

接受技術者具備基礎建議(專業)

PCB或IC substrate基板材料相關技術。

技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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