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工業技術研究院

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技術名稱: 異方性導電膠膜材料技術

技術簡介

於異方性導電膠膜材料(Anisotropic Conductive Film,ACF)接合具備細線化、製程簡單、符合無鉛環保製程要求及無α-粒子等特性,在電子產品的應用上(如:COG、COF與LCD模組組裝)有其優異之處。本計畫以開發細線路化(finer pitch)應用之異方性導電膠膜ACF材料為主要計畫目標,同時為加強異方性導電膠材料及相關技術符合先進電子構裝之高速、高腳數、細線路化及高可靠性的要求,提出新型之導電粉體表面改質專利構想,並完成ACF材料在60μm pitch COG測試載具上電性及推力的測試評估、ACF材料在70μm pitch COF測試載具上電性、推力和可靠度的驗證,同時本計畫亦成功開發自有專利之新型導電粉體表面改質技術。

Abstract

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技術規格

完成異方性導電膠膜材料技術建立包括配方與壓著製程評估之建立,開發完成異方性導電膠膜材料物性可達:接著強度>0.5 kgf /μm,接續電阻=20Ω,絕緣電阻=10^12Ω,使用電壓範圍<10V,使用電流<5mA/mm^2,使用溫度- 40~80℃,Tg >140℃。

Technical Specification

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技術特色

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應用範圍

可應用環保型半導體封裝製程材料如覆晶構裝之重工、BGA或CSP之封裝重工及無鉛焊錫之替代應用等。

接受技術者具備基礎建議(設備)

1. 反應槽體 2. 塗佈機台與分條機 3. 貼合測試設備

接受技術者具備基礎建議(專業)

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技術分類 電子有機材料

聯絡資訊

聯絡人:李巡天 光電有機材料及應用研究組

電話:+886-3-5913168 或 Email:htli@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820057

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