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工業技術研究院

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技術名稱: f-mCOC/Epoxy耐熱低介電難燃高頻基板材料技術

技術簡介

1.用mCOC低介電之特性搭配環氧樹脂及反應型難燃劑製作低介電耐熱難燃高頻基板 2.本材料配方目前已申請中、美、日專利 none

Abstract

mCOC has good dielectric and thermal properties so it can be used to make high frequency substrates with epoxy resin.

技術規格

介電常數<3.5@1GHz;UL 94 V0;通過熱測試(Pressure cooker>30min;Solder>60sec);熱膨脹係數 (Z axis)<60ppm;玻璃轉移溫度>180℃

Technical Specification

Dk<3.5@1GHz;UL 94 V0;Pass thermal test (Pressure cooker>30min;Solder>60sec);CTE (Z axis)<60ppm;Tg>180℃

技術特色

低介電常數;耐然達到UL 94 V0等級;耐熱性佳;熱膨脹係數與其他材料匹配;基板製程不需大幅更動

應用範圍

3G手機、通訊用基板、無線傳輸相關設備零組件、高速電腦、基地台、伺服器、多媒體、數位相機

接受技術者具備基礎建議(設備)

印刷電路板及銅箔基板相似之設備

接受技術者具備基礎建議(專業)

印刷電路板相關知識

技術分類 高分子材料

聯絡資訊

聯絡人:陳建明 高分子研究組

電話:+886-3-5732483 或 Email:JeremyChen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5732347

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