『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 銅箔技術

技術簡介

藉由添加劑調整生箔的物性,如粗糙度、強度、延伸率、耐折等物性。此外,搭配銅箔後處理技術提高銅箔與基材間抗撕強及耐化、耐熱性。

Abstract

.

技術規格

依下游需求可調整

Technical Specification

.

技術特色

低粗糙度、高強度、高延伸率、高耐折銅箔及超薄銅箔技術,及提高銅箔與基材間抗撕強度的瘤化技術、耐化、耐熱表面處理。

應用範圍

使用於細線路HDI 、PCB、高多層之高性能印刷電路板、IC載板、散熱板、 軟性印刷電路板、 鋰離子電池集電體。

接受技術者具備基礎建議(設備)

銅箔業者

接受技術者具備基礎建議(專業)

電化學及化工專長

技術分類 金屬材料

聯絡資訊

聯絡人:邱秋燕 功能設計與複材研究組

電話:+886-3-5915278 或 Email:chiuyen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820207

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]