『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 電鑄網版技術

技術簡介

複合網板的製作方法建立,包括不鏽鋼金屬網與鎳金屬箔的接合技術,整合黃光製程及電鑄製程,及無應力電鑄金屬箔的製程控制技術。

Abstract

Use the dry film as photo resister to reduce the cost of manufacture of the composite metal stencil. The main produce is metal stencil for touch panel. The pattern is designed as circular for touch panel. The Thickness of electroformed metal sheet was controlled by a thickness of fry film.

技術規格

電鑄技術開發複合式網板製作技術,面積20×20cm,金屬箔厚度10~50μm,不鏽鋼網為325mesh,接合後開孔率為原開孔率的70%以上。

Technical Specification

Specifications of the stencil!G20!N20cm, 10~50£gm thickness, 325 mesh.

技術特色

1.電鑄鎳金屬箔厚度變異量 ± 8%,表面具光澤性,目視無針孔、無應力呈現之現象,開孔或線寬最低可達20μm。 2.無需考慮孤島型形狀設計的複合式印刷網板。 3.可使用於需強力特殊溶劑配製之印刷漿料。

應用範圍

印刷電路板構裝,半導體構裝產業上製作BGA,CSP基板及 Flip chip構裝用金屬印刷網板、有機電激發光顯示器用之有機發光材料蒸鍍過程用蒸鍍罩、液晶顯示器製造流程用之印刷金屬網板、無線網路產業用之無線射頻器內感應線圈印刷用金屬網板。

接受技術者具備基礎建議(設備)

曝光機、顯影機、電鑄機、鑄液控制分析系統

接受技術者具備基礎建議(專業)

電化學、熟悉微影製程

技術分類 金屬材料

聯絡資訊

聯絡人:陳興華 金屬材料研究組

電話:+886-3-5915233 或 Email:edwardchen@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820259

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]