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工業技術研究院

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技術名稱: 高頻高Q共燒材料技術

技術簡介

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Abstract

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技術規格

◎電陶瓷基板使用頻率<10GHz,材料特性頻率穩定性ΔK<1%,Q值>1000 ◎電阻值~1kohm±20%,TCR<100ppm/℃;介電常數~20±15%,TCC<100ppm/℃;電感材料Q>20

Technical Specification

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技術特色

在通訊及光通訊領域中,電子元組件的高頻化、模組化及封裝應用之集積化趨勢加上全球環保意識成熟,促使低溫共燒陶瓷(Low Temperature Cofired Ceramics, LTCC)朝向高頻穩定、元件內埋及無鉛化的材料開發。LTCC基材可將電阻電容電感及導體材料直接埋入其中,且基材表面可同時封裝IC等主動元件,除了可提高線路及元件積體密度,亦可增加功能性元件,以達到體積小功能多之目的。

應用範圍

無線通信用被動元件,如:晶片電感、濾波器、天線、平衡/非平衡轉換器、耦合器等。已被廣泛使用於手機、無線區域網路、藍芽等無線通信系統中,包括手機、PDA等通訊用前端射頻模組與封裝用陶瓷基板。

接受技術者具備基礎建議(設備)

◎硬體:三滾筒、流變儀、網印機、切割機、燒結爐、Multimeter、恆溫恆濕箱 ◎軟體:SPC分析軟體、溫度特性測試軟體

接受技術者具備基礎建議(專業)

材料、化工、電機電子、化學

技術分類 無機材料

聯絡資訊

聯絡人:林鴻欽 電子材料及元件研究組

電話:+886-3-5915200 或 Email:linsc@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820206

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