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工業技術研究院

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技術名稱: 薄膜狀低介電損失低介電常數非鹵非磷系構裝載板用耐燃增層介電材料技術

技術簡介

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Abstract

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技術規格

此薄膜狀低介電損失低介電常數非鹵非磷系構裝載板用耐燃增層介電材料之特性如下:Tg為187℃,CTE為28.3ppm/℃,介電常數為3.5,介電損失為 0.008,吸濕性為1%,符合UL 94-V0水準。與國際相關無鹵商品比較,皆可符合應用產品的功能規格要求。

Technical Specification

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技術特色

本技術藉已開發新型具高氮含量之無鹵無磷反應型難燃樹脂,再搭配粉體處理、精密塗佈及壓合等技術進行開發。此材料與現有PCB製程相容性高,並具備高耐熱、高可靠度、高散熱、低膨脹係數、低介電常數與低介電損失之特性。

應用範圍

可攜式電子產品 (Mobile Phone、Notebook PC 、PDA...)、高速通訊與資訊系統、邏輯IC用構裝載板、半導體微處理器

接受技術者具備基礎建議(設備)

1.反應槽或攪拌槽、精密塗佈機、壓合機、PCB測試設備與儀器 2.拉撕強度、Tg、CTE、介電性質、耐熱性、耐燃性、抗銲錫等相關物性測試設備

接受技術者具備基礎建議(專業)

化學、化工、材料、具PCB相關經驗人員

技術分類 工程與自動化研究

聯絡資訊

聯絡人:邱國展 電子材料及元件研究組

電話:+886-3-5916895 或 Email:JeffreyChiou@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5820215

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