工業技術研究院

技術簡介

半導體等高科技產業工廠排放的廢氣特性為大風量、低濃度，其中經常含有酸性及鹼性污染物，例如HCl、HF與NH3等。用於處理這些污染物的廢氣洗滌塔去除效率普遍不佳，且有隨濃度降低而下降的趨勢。 本技術利用兩段式洗滌，包括噴霧式洗滌及填充式洗滌，克服處理酸鹼共排問題；而在洗滌液中添加界面活性劑，則已驗證確實可以改善在低濃度範圍之洗滌效率。

Abstract

Semiconductor factory’s waste gases contain both acidic and basic gaseous pollutants emitting to the ambient after the central scrubber treatment. Mostly, the exhaust gas has high volumetric flow rates and contains gaseous pollutants in low concentration level.The facilities usually use conventional wet-scrubbing technology to control low-concentration gaseous pollutants. It has been reported that the performance of the scrubbers cannot meet the semiconductor air pollution emission standard for such pollutants. This technology employs two sections of scrubbers, namely a fine water mist section (spray column) followed by a packed tower, to remove HCl, HF and NH3 simultaneously. With the use of ionic surfactants, it has been demonstrated to improve the removal efficiency for the low concentration pollutants significantly.

技術規格

NH3去除效率＞90％ ＠ 1 ppm HCl去除效率＞90％ ＠ 1 ppm HF去除效率＞90％ ＠ 1 ppm

Technical Specification

Removal Efficiency of NH3 ＞90％ ＠ 1 ppm Removal Efficiency of HCl ＞90％ ＠ 1 ppm Removal Efficiency of HF ＞90％ ＠ 1 ppm

技術特色

可以僅針對現有洗滌塔進行局部改善或是提供增建新型洗滌塔之服務,不增加廢水處理負擔。

應用範圍

排放低濃度無機酸鹼廢氣之半導體、光電等高科技產業工廠。

接受技術者具備基礎建議（設備）

洗滌塔

接受技術者具備基礎建議（專業）

洗滌塔工程經驗

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