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工業技術研究院

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技術名稱: 環保型無鹵高尺寸安定性基板材料開發

技術簡介

本計畫進行適合印刷路板(PCB)業使用之高Tg環氧樹脂篩選,同時進行無鹵無磷之難燃劑的篩選與製備,並結合奈米無機物之改質以製備高尺寸安定性無鹵無磷基板材料,包括(1)具無鹵無磷耐燃新型樹脂配方之難燃性測試與化學流變性調控, (3)無鹵無磷奈米級膠片製備/基板壓合製程技術, (4)奈米結構分析與性能評估技術的建立與探討,且搭配PCB業之現有製程進行後加工性(如剛性、韌性、鑽孔、製線…等)可行性之評估。

Abstract

we develop the high performance halogen-free and phorphorus-free materials used in printed circuit boards (PCBs) by high Tg epoxy resin、nonhalogen-nonphosphorus flame retardant and inorganic compounds. processes including novel formulation prepred and properties were obtained susessfully such as UL-94 V0, prepregs and laminates technologies.

技術規格

難燃性UL94-V0 - Tg>=150℃ - Z軸膨脹率( 50→260℃)<=3.5 % - Solderability( 288℃) > 5min - peel strength : 8~10 lb / in

Technical Specification

- UL94-V0 - Tg>=150℃ - Z%( 50→260℃)<=3.5 % - Solderability( 288℃) > 5min - peel strength : 8~10 lb / in

技術特色

目前市面遍用之環保基板材料多為無鹵素含磷化物之材料, 其Tg 溫度較低與吸水性較高之缺點無法因應未來高尺寸安定性之技術如無鉛製程需求, 本計畫目前之成果可克服此二項缺點, 未來更可將性質提升至高Tg (160~180℃) 之UL-94 V0 之水平.

應用範圍

‧ 環保型板材市場 -無鹵含磷 -無鹵無磷 ‧ 高尺寸安定性板材市場 -光電板(既薄且長) -無鉛製程(solder融點183℃→ 217℃)

接受技術者具備基礎建議(設備)

DSC、TGA、TMA、流變儀及電路板高壓加溫合模機台

接受技術者具備基礎建議(專業)

有機/無機混成、電路板製備、材料物性測試

技術分類 高分子材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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