『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 地電阻影像剖面探測技術

技術簡介

地電阻影像剖面法是一種非破壞性的檢測技術,由分析地下介質的電阻特性以推判地下構造組織,可應用在地質、工程地質、環境污染、地下空洞等多方面。

Abstract

Resistivity Image Profiling (RIP) method is one of the non-destructive techniques based on analyzing the resistance characteristics of material to estimate subsurface condition. It is widely applied in many fields including geological survey, engineering investigation, environmental investigation and cavity detection.

技術規格

1. 傳導電流:2-1000 mA 2. 量測電壓敏感度:0.5 μV 3. 探測深度:1-500 m

Technical Specification

1.Conduction current: 2-1000 mA 2.Measurement voltage sensitivity: 0.5 μV 3.Penetrating depth: 1-500 m

技術特色

非破壞式探測,具高敏感度,可快速獲取大量高品質的地層資訊,解析地下構造的變化。

應用範圍

地下水探測、溫泉探測、工程地質、環境污染、防災監測等

接受技術者具備基礎建議(設備)

none

接受技術者具備基礎建議(專業)

地球物理、地質與訊號分析

技術分類 02 H資源應用技術

聯絡資訊

聯絡人:陳文山 風力及資源利用技術組

電話:+886-6-3636632 或 Email:alexix@itri.org.tw

客服專線:+886-800-45-8899

傳真:

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]