『您的瀏覽器不支援JavaScript功能,若網頁功能無法正常使用時,請開啟瀏覽器JavaScript狀態』

跳到主要內容區塊

工業技術研究院

:::

技術名稱: 基板用高機能性交聯劑技術開發

技術簡介

利用交聯劑結構修飾方式,賦予交聯劑難燃特性,以取代或減少目前業界以添加大量無機粉體以達無鹵無磷難燃特性之作法。

Abstract

none

技術規格

與環氧樹脂交聯壓合形成基板之性質:1. 玻璃轉移溫度(Tg)≧180℃,2.熱膨脹係數(α1)≦55ppm/℃,3.吸水性(%)≦0.54.難燃性(UL-94):V0

Technical Specification

none

技術特色

可改善加工特性、降低生產成本及提昇良率。

應用範圍

印刷電路板,環氧樹脂相關產業

接受技術者具備基礎建議(設備)

樹脂合成設備、配方混料設備、基板壓合設備

接受技術者具備基礎建議(專業)

none

技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:03-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:03-5914944

[{"text":"企業網","weight":13.0},{"text":"材化所","weight":11.5},{"text":"機械所","weight":10.0},{"text":"綠能所","weight":9.4},{"text":"生醫所","weight":8.0},{"text":"半導體","weight":6.2},{"text":"南分院","weight":5.0},{"text":"太陽能","weight":5.0},{"text":"課程","weight":5.0},{"text":"遠紅外線","weight":5.0},{"text":"雷射","weight":4.0},{"text":"LED","weight":4.0},{"text":"LED可見光","weight":3.0},{"text":"5G","weight":3.0},{"text":"工研人","weight":3.0},{"text":"電光所","weight":3.0},{"text":"綠能與環境研究所","weight":3.0},{"text":"機械","weight":3.0},{"text":"資通所","weight":2.0},{"text":"面板","weight":2.0},{"text":"文字轉語音","weight":2.0},{"text":"實習","weight":2.0},{"text":"無人機","weight":2.0},{"text":"生醫","weight":2.0},{"text":"3D","weight":2.0},{"text":"v2x","weight":2.0},{"text":"員工","weight":2.0},{"text":"地圖","weight":2.0},{"text":"太陽光電","weight":2.0},{"text":"材料與化工研究所","weight":1.0}]