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工業技術研究院

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技術名稱: 具撓曲性之低損失高介電基板材料技術

技術簡介

主要利用low loss 的高介電陶瓷粉體與低介電損失的高撓曲性樹脂做?混,其中牽涉技術包括陶瓷粉體的分散技術、高撓曲性樹脂的設計、合成及樹脂配方的最佳化,在經砂磨機進行混成實驗及塗佈壓合實驗製程開發,即可得到高撓曲性的低介電損失之高介電基板材料。

Abstract

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技術規格

高頻下具有相當穩定的介電特性:其DK值在1MHz~6GHz下都可維持在DK20左右,DF值更可控制在0.02以下。

Technical Specification

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技術特色

高頻下具有相當穩定的介電特性之低損失高介電基板材料很適合用於內藏電容RF模組,如BlueTooth, WLAN, WiMAX等,以及天線的縮小化應用。

應用範圍

應用產品涵蓋可攜式電子產品,如手機等。

接受技術者具備基礎建議(設備)

有機/無機混成分散設備、塗佈設備、基板壓合設備

接受技術者具備基礎建議(專業)

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技術分類 電子有機材料

聯絡資訊

聯絡人:楊偉達 電子材料及元件研究組

電話:+886-3-5912979 或 Email:WeitaYang@itri.org.tw

客服專線:+886-800-45-8899

傳真:+886-3-5914944

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